Local humidity control system for low temperature electronic module

A local humidity control system for maintaining a surface of a cooled electronic device above an ambient dew point, said local humidity control system comprising:

• a first layer of thermal insulation at least partially surrounding and contacting the cooled electronic device;
• a second layer of thermal insulation surrounding the first layer of thermal insulation and the cooled electronic device in which a volume is defined between the first and second layers of thermal insulation;
• and
• a heater assembly for heating said volume to a temperature sufficient to maintain the surface of said cooled electronic device above said ambient dew point, wherein the heater assembly comprises a thin film heater attached to said first layer of thermal insulation for maintaining a surface of said first layer of thermal insulation above said ambient dew point, and wherein the heater further comprises a wire mesh heater suspended in the volume to lower relative humidity in the volume and inhibit the ingress of water vapor.

An electronic device assembly comprising:

• a cooled electronic device;
• a first layer of thermal insulation at least partially surrounding and contacting the cooled electronic device;
• a second layer of thermal insulation surrounding the first layer of thermal insulation and the cooled electronic device in which a closed volume comprising trapped air is defined between the first and second layers of thermal insulation;
• and
• a heater assembly for heating said closed volume to a temperature sufficient to maintain a surface of the cooled electronic device above an ambient dew point.

An electronic device assembly comprising:

• a cooled electronic device;
• a first layer of thermal insulation at least partially surrounding and contacting the cooled electronic device;
• second layer of thermal insulation surrounding the first layer of thermal insulation and the cooled electronic device in which a volume is defined between the first and second layers of thermal insulation;
• a heater assembly for heating said volume to a temperature sufficient to maintain a surface of the cooled electronic device above an ambient dew point;
• and
• wherein said heater assembly comprises a wire mesh heater suspended in said volume to lower relative humidity in the volume and inhibit the ingress of water vapor.

An electronic device assembly comprising:

• an electronic module comprising at least one integrated circuit chip;
• a cold plate thermally coupled to said electronic module for cooling said at least one integrated circuit chip;
• a local humidity control system surrounding and at least partially contacting said electronic module for maintaining a surface of said electronic module above an ambient dew point, wherein said local humidity control system comprises a first layer of thermal insulation at least partially surrounding and contacting the electronic module, and a second layer of thermal insulation surrounding the first layer of thermal insulation and the electronic module, wherein a closed volume comprising trapped air is defined between the first and second layers of thermal insulation;
• and
• a heater assembly for heating said closed volume to a temperature sufficient to maintain a surface of the electronic module above an ambient dew point.

A method for fabricating an electronic device assembly, said method comprising:

• providing an electronic module;
• thermally coupling a cold plate to the electronic module;
• providing a first layer of thermal insulation at least partially surrounding the electronic module;
• providing a second layer of thermal insulation surrounding the first layer of thermal insulation and spaced therefrom to define a closed volume comprising trapped air therebetween;
• and
• disposing a heater assembly within said volume for heating said volume to a temperature sufficient to maintain a surface of the electronic module above an ambient dew point.

A method for fabricating an electronic device assembly, said method comprising:

• providing an electronic module;
• thermally coupling a cold plate to the electronic module;
• providing a first layer of thermal insulation at least partially surrounding the electronic module;
• providing a second layer of thermal insulation surrounding the first layer of thermal insulation and spaced therefrom to define a volume therebetween;
• disposing a heater assembly within said volume for heating said volume to a temperature sufficient to maintain a surface of the electronic module above an ambient dew point;
• wherein said providing of said first layer of thermal insulation comprises providing a layer of thermal insulation surrounding and contacting an edge of said electronic module, and wherein said disposing of said heater assembly comprises providing a thin film heater attached to said first layer of thermal insulation for maintaining a surface of said first layer of thermal insulation above said ambient dew point;
• and
• wherein said disposing of said heater assembly within said volume further comprises disposing a wire mesh heater suspended within said volume to lower relative humidity in the volume and inhibit the ingress of water vapor, said wire mesh heater being supported by said second layer of thermal insulation.