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US 6,143,978 AGranted
Enclosure for dissipating heat away from a heat sensitive device using bicarbonate compositions
AssigneeAlliedSignal Inc.
InventorsJane Ren, Christopher E. Osuch, Richard A. Olzak, Amanda L. Plyley
Life of this patent
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Abstract
The present invention provides methods and compositions useful for heat absorption and dissipation, which include between about 10 percent and about 99 percent by weight of a bicarbonate compound and between about 90 percent and about 1 percent by weight of binder, and thermally protected enclosures including the same.
Claims6
An enclosure for thermally protecting one or more heat sensitive devices from a high temperature environment, said enclosure comprising:
- an outer housing having interior surfaces defining an interior cavity, said interior cavity for containing said one or more heat sensitive devices;
- a composition comprising between about 10 percent and about 100 percent by weight of a bicarbonate compound;
- wherein said composition occupies at least a portion of said interior cavity and substantially encloses said one or more heat sensitive devices;
- and
- wherein said bicarbonate compound exhibits endothermic decomposition when said enclosure is subjected to said high temperature environment, and wherein said composition absorbs heat from said high temperature environment during said endothermic decomposition of said bicarbonate compound.
2 more elements
Dependencies are inferred from the claim text.