Curable composition for back-protecting material in making shadow mask

Abstract

The present invention provides a curable composition for back-protecting material used in making shadow masks which gives a cured film excellent in all of etching resistance, alkali solubility or peelability, and pattern formability even when a second etching is carried out at high temperatures. That is, the present invention provides a curable composition for back-protecting material used at a second etching step in making shadow masks which comprises the following components (a), (b) and (c) and which gives a cured film having alkali solubility or alkali peelability: (a) a compound having one carboxyl group and one (meth)acryloyl group, (b) a tri(meth)acrylate of an alkylene oxide adduct of isocyanuric acid, and (c) (c1) a (meth)acrylate compound having two or more (meth)acryloyl groups, (c2) a chain transfer agent, or a combination of (c1) and (c2).

Dependencies are inferred from the claim text.