Surface treatment composition and method for treating surface of substrate by using the same

A surface treatment composition for treating the surface of a semi-conductor substrate containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt:

• ##STR3## wherein X.sub.1 and X.sub.2 are hydroxyl groups;
• Y.sub.1 to Y.sub.8 are respectively independently a hydrogen atom, a halogen atom, a sulfonic acid group, an alkoxy group which may have a substituent, or an alkyl substituted with halide or cyano, provided that at least one of Y.sub.1 to Y.sub.8 is not a hydrogen atom;
• Z.sub.1 and Z.sub.4 are respectively independently a hydrogen atom, a carboxyl group or a --CH.sub.2 CO.sub.2 H group;
• Z.sub.2 and Z.sub.3 are respectively independently a hydrogen atom or a --CH.sub.2 CO.sub.2 H group;
• and R.sub.1 to R.sub.4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent, wherein said liquid medium contains an alkaline component selected from the group consisting of ammonia, quaternary ammonium salt hydroxides, potassium hydroxide, sodium hydroxide, calcium hydroxide, sodium hydrogen carbonate and ammonium hydrogen carbonate at a concentration of the alkaline compound of from 0.01 to 30 wt %, a concentration of the formula (1) complexing agent from 10.sup.-7 to 5 wt % and a metal impurity concentration per each metal of at most 10.sup.-4 wt %.