Cleaning agent
AssigneeWako Pure Chemical Industries, Ltd.
InventorsMasahiko Kakizawa, Osamu Ichikawa, Ichiro Hayashida
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Abstract
Removing particles and metallic contaminants without corrosing the metallized wirings and without giving adverse effect of planarization on the semiconductor substrate surface can be effectively achieved by use of a cleaning agent which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.
Claims2
A cleaning method for a semiconductor substrate surface having metallized wirings, which comprises treating the semiconductor surface with a cleaning agent consisting essentially of (1) an organic acid having at least one carboxyl group and (2) a complexing agent other than the organic acid having chelating ability to remove metallic contaminants on the substrate surface without corroding the metallized wirings.
Dependencies are inferred from the claim text.