Methods of forming electrically conductive interconnections and electrically interconnected substrates

A method of forming an electrically conductive interconnection comprising:

• providing a first substrate having an outer surface;
• forming a layer of material over the outer surface;
• forming openings through the layer of material and exposing selected outer surface portions;
• forming a non-solidified conductive material within the openings and exposing the first substrate to conditions effective to harden the conductive material and form masses of conductive material within the respective openings, at least one of the masses having a generally planar, outwardly exposed outermost surface;
• providing a second substrate having a homogeneous conductive structure disposed thereover, the homogeneous conductive structure having an outwardly exposed uppermost surface facing generally away from the second substrate and defining a first conductive structure surface area;
• engaging the conductive structure's uppermost surface with the planar outermost surface of the one mass;
• and
• deforming at least a portion of the conductive structure with the planar outermost surface sufficient to define a second conductive structure surface area that is less than the first conductive structure surface area.

A method of forming an electrically conductive interconnection comprising:

• providing a first substrate having an outer surface;
• forming a layer of material over the outer surface;
• forming a conductive mass of material over the outer surface and received within the layer of material;
• removing the layer of material and leaving the conductive mass over the outer surface;
• and
• extending the conductive mass into a conductive structure on a second substrate, at least a portion of the conductive mass having material of the conductive structure disposed laterally adjacent thereto.

A method of forming an electrically conductive interconnection comprising:

• providing a first substrate having an outer surface;
• forming a layer of material over the outer surface;
• forming a conductive mass of material received within the layer of material, the conductive mass having a generally planar uppermost surface;
• after forming the conductive mass having the generally planar uppermost surface, removing the layer of material and leaving the conductive mass over the outer surface;
• and
• engaging the planar uppermost surface of the conductive mass with a conductive structure on a second substrate, the conductive structure having an interconnect surface which includes at least one sidewall which extends away from a second substrate surface, the planar uppermost surface of the conductive mass extending through the conductive structure's interconnect surface and being disposed laterally to the one sidewall.

A method of forming an electrically conductive interconnection comprising:

• providing a first substrate having an outer surface;
• forming a conductive mass of material over the outer surface, the conductive mass having a pair of generally oppositely-facing sidewalls joined with the substrate and extending generally transversely away therefrom and a generally planar uppermost surface joined with the sidewalls and extending therebetween;
• providing a second substrate having an outer surface and a conductive structure disposed over the second substrate's outer surface, the conductive structure having a surface area consisting of a first portion which makes physical contact with the second substrate's outer surface, and a second portion which does not make physical contact with the second substrate's outer surface, the second portion being substantially outwardly exposed;
• and
• extending the conductive mass of material into the conductive structure over the second substrate's outer surface and bonding the conductive structure with both (a) at least a portion of the uppermost surface of the conductive mass, and (b) at least a portion of one of the sidewalls of the conductive mass.

A method of forming an electrically conductive interconnection comprising:

• providing a first substrate having an outer surface;
• providing a second substrate having a conductive interconnect surface;
• forming an insulative layer of material over the first substrate's outer surface;
• removing a portion of the insulative layer;
• forming conductive material over the first substrate and replacing the removed portion of the insulative layer, the insulative layer of material and the conductive material having respective portions which define generally planar surfaces proximate and coplanar with one another;
• and
• contacting the planar surfaces of the conductive material and the insulative layer of material with the second substrate's conductive interconnect surface;
• wherein the conductive interconnect surface comprises a conductive structure having a shape which extends away from a second substrate outer surface;
• and
• the contacting comprises moving the first substrate toward and against the conductive structure sufficient to change the conductive structure shape.