Photosensitive polybenzoxazole precursor compositions
AssigneeArch Specialty Chemicals, Inc.
InventorsSteve Lien-Chung Hsu, Pamela J. Waterson, Ahmad Naiini, William D. Weber, Sanjay Malik, Andrew J. Blakeney
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AssigneeArch Specialty Chemicals, Inc.
InventorsSteve Lien-Chung Hsu, Pamela J. Waterson, Ahmad Naiini, William D. Weber, Sanjay Malik, Andrew J. Blakeney
Estimating the term…
A heat resistant positive-working photosensitive composition that has a polybenzoxazole precursor bearing acid labile functional groups, a photoacid generator, a photosensitizer, and a solvent. The polybenzoxazole precursor bearing acid labile functional groups, has the structure: ##STR1## wherein k.sub.1 is an integer of 1 or 2, k.sub.2 is an interger of 0 or 1, and the sum of k.sub.1 and k.sub.2 is 2; Ar.sub.1 is a tetravalent aromatic, aliphatic, or heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, aliphatic, or heterocyclic group or siloxane group; D is a monovalent acid labile group; and n is an integer from 20 to 200. A portion of Ar.sub.1 can be a divalent aromatic, aliphatic, or heterocyclic diamine moiety such that the fraction of diamine compound is 0-60 mole percent and the sum of diamine and diamino dihydroxy compound is 100%. Preparation of chemical amplification based positive-working, aqueous base developable photosensitive polybenzoxazole (PBO) precursors, the formulation of the resin composition, and the process for preparing heat-resistant relief structures from this resin composition. The positive photosensitive resin compositions are suitable especially for applications in microelectronics.
A positive-working photosensitive composition comprising:
A photosensitive resin comprising:
A process for preparing an polybenzoxazole precursor bearing acid labile functional groups having a blocking level about 1% to 100%, comprising one of the following steps of:
A process for the preparation of a heat-resistant relief image comprising the steps of:
Dependencies are inferred from the claim text.