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US 6,143,421 AGranted
Electronic components incorporating ceramic-metal composites
AssigneeCoorsTek, Inc.
InventorsMarcus A. Ritland, Dennis W. Readey, James E. Stephan, Dean A. Rulis, Jack D. Sibold
Life of this patent
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Abstract
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.
Claims15
A substrate for a ceramic device, comprising:
- (a) a thin ceramic sheet having an upper surface and a lower surface;
- and
- (b) a plurality of vias on said upper surface of said ceramic sheet and extending through said sheet;
- wherein said vias comprise a ceramic-metal composite comprising a substantially continuous ceramic phase and a substantially continuous metal phase wherein said ceramic-metal composite is formed by infiltrating a metal into a ceramic having a substantially continuous porous structure.
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A substrate useful for mounting electronic components, comprising:
- (a) a substantially flat ceramic sheet having an upper surface and a lower surface;
- and
- (b) a layer adhered to at least a portion of said lower surface of said ceramic sheet consisting essentially of a ceramic-metal composite wherein said ceramic-metal composite is formed by infiltrating a metal into a ceramic having a substantially continuous porous structure.
A method for forming a metal plane on an electronic substrate, comprising the steps of:
- (a) forming a substantially flat ceramic sheet having a porous ceramic layer adhered to at least a portion of said ceramic sheet;
- (b) contacting said porous ceramic layer with molten metal under conditions sufficient to permit infiltration of said metal into said porous ceramic layer;
- and
- (c) cooling said infiltrated porous layer to form a ceramic sheet having a ceramic-metal composite layer adhered thereon.
1 more element
Dependencies are inferred from the claim text.