Polycarbodiimide resin-containing adhesive and flexible printed circuit board
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYasuyoshi Komoto, Akira Hayashida, Michio Aizawa, Hitoshi Arai, Ken Yahata
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Abstract
Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula: .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n wherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.
Claims10
A flexible printed circuit board wherein the circuit board is obtained by bonding a metal foil to a heat-resistant insulation film through an adhesive consisted solely of a polycarbodiimide resin represented by the formula:
- .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n
- wherein n is an integer of 5 to 20.
A flexible printed circuit board wherein the circuit board is obtained by bonding a metal foil to a heat-resistant insulation film through an adhesive composed of 100 parts by weight of a polycarbodiimide resin represented by the formula:
- .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n
- wherein n is an integer of 5 to 20 and 0 to 20 parts by weight of an epoxy resin type adhesive.
A coverlay film wherein the film is obtained by bonding a peeling material to a heat-resistant insulation film through an adhesive consisting solely of a polycarbodiimide resin represented by the formula:
- .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n
- wherein n is an integer of 5 to 20.
A coverlay film wherein the film is obtained by bonding a peeling material to a heat-resistant insulation film through an adhesive composed of 100 parts by weight of a polycarbodiimide resin represented by the formula:
- .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n
- wherein n is an integer of 5 to 20 and 0 to 20 parts by weight of an epoxy resin type adhesive.
Dependencies are inferred from the claim text.