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US 6,143,401 AGranted
Electronic chip package
AssigneeW. L. Gore & Associates, Inc.
InventorsPaul J. Fischer, Joseph Korleski
Life of this patent
Estimating the term…
Abstract
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature T.sub.g greater than 200.degree. C. and a volumetric coefficient of thermal expansion of .ltoreq.75 ppm/.degree.C. A semiconductor device is electrically attached to the laminated substrate.
Claims11
A chip package comprising:
- a laminated substrate having at least one conductive layer;
- and at least one dielectric layer bonded to the conductive layer, the dielectric layer having a glass transition temperature T.sub.g greater than 200.degree. C. a volumetric coefficient of thermal expansion 75 ppm/.degree.C. and the dielectric layer is an expanded organic material having an inorganic filler material;
- and
- a semiconductor device electrically attached to the laminated substrate.
1 more element
A chip package comprising:
- a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, the dielectric layer including expanded polytetrafluoroethylene, and wherein the dielectric layer has a glass transition temperature (T.sub.g) greater than 200.degree. C. and a volumetric coefficient of thermal expansion of .ltoreq.75 ppm/.degree.C.;
- and
- a semiconductor device electrically attached to the laminated substrate.
A chip package comprising:
- a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, the dielectric layer including expanded polytetrafluoroethylene, an organic resin and an inorganic filler which is a particulate, and wherein the dielectric layer has a glass transition temperature (T.sub.g) greater than 200.degree. C.;
- and
- a semiconductor device electrically attached to the laminated substrate.
Dependencies are inferred from the claim text.