Aromatic polyimide film
AssigneeUbe Industries, Ltd.
InventorsTakashi Kohno, Hideaki Okihara, Akinori Otani, Susumu Morishige
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Abstract
An aromatic polyimide film which is favorably employed for preparing a laminate of an aromatic polyimide film, an adhesive layer, and an electroconductive sheet is made of a polyimide prepared from a tetracarboxylic acid component containing at least 15 molar % of biphenyltetracarboxylic acid (or its dianhydride or ester) and an aromatic diamine component containing at least 5 molar % of phenylenediamine, has a specific edge tearing resistance of 11 to 22 kg/20 mm/10 .mu.m, and contains not more than 0.4 weight percent of a volatile component.
Claims7
An aromatic polyimide film which has a thickness in the range of 10 to 125 .mu.m and comprises a polyimide prepared from a tetracarboxylic acid component and an aromatic diamine component comprising at least 5 molar % of phenylenediamine, wherein the polyimide film has a specific edge tearing resistance of 11 to 20 kg/20 mm/10 .mu.m, a tensile modulus of not lower than 450 kg/mm.sup.2, and a coefficient of linear expansion in the temperature range of 50 to 200.degree. C. of not higher than 2.5.times.10.sup.-5 cm/cm/.degree. C.
A laminate comprising an aromatic polyimide film, an adhesive layer, and an electroconductive sheet, wherein the aromatic polyimide film has a thickness in the range of 10 to 125 .mu.m and comprises a polyimide prepared from a tetracarboxylic acid component and an aromatic diamine component comprising at least 5 molar % of phenylenediamine, wherein the polyimide film has a specific edge tearing resistance of 11 to 20 kg/20 mm/10 .mu.m, a tensile modulus of not lower than 450 kg/mm.sup.2, and a coefficient of linear expansion in the temperature range of 50 to 200.degree. C. of not higher than 2.5.times.10.sup.-5 cm/cm.degree. C.
Dependencies are inferred from the claim text.