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US 6,143,396 AGranted
System and method for reinforcing a bond pad
AssigneeTexas Instruments Incorporated
InventorsMukul Saran, Charles A. Martin
Life of this patent
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Abstract
The reinforcing system (10, 70, 90) for a bond pad (12, 72, 92) includes at least one dielectric layer or stack (20, 21, 22, 76, 78, 96, 98) disposed under the bond pad (12, 72, 92). A reinforcing patterned structure (30, 80, 82, 100, 102) is disposed in the dielectric layer or stack (20, 21, 22, 76, 78, 96, 98).
Claims16
A reinforcing system for a bond pad comprising:
- at least one dielectric layer disposed under the bond pad;
- a reinforcing patterned structure disposed in the at least one dielectric layer;
- and
- wherein the reinforcing patterned structure includes alternating layers of weak dielectric layers and nonweak dielectric layers having parallel lines oriented generally perpendicularly with one another.
1 more element
A reinforcing system for a bond pad comprising:
- at least two dielectric layers disposed under the bond pad;
- a reinforcing patterned structure disposed in the at least one dielectric layer;
- wherein at least one dielectric layer includes a weak organic dielectric layer;
- and
- wherein another dielectric layer includes a nonweak dielectric layer between said weak dielectric layer and said bond pad.
2 more elements
A bond pad reinforcing system comprising:
- a dielectric stack disposed under a bond pad;
- a metal reinforcing patterned structure disposed in the dielectric stack;
- and
- wherein the reinforcing patterned structure includes alternating layers of weak dielectric layers and nonweak dielectric layers having parallel lines oriented generally perpendicularly with one another.
1 more element
Dependencies are inferred from the claim text.