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AssigneeE. I. Du Pont de Nemours and Company
InventorsAllan Cairncross, John Edwin Gantzhorn, Jr.
Estimating the term…
Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an array of tacky and non-tacky areas with particles adhered thereon for a period of time and at a temperature to allow the particles to adhere and center to the tacky areas. The surface containing the array of tacky and non-tacky areas can be heated either prior to, during or after a step of contacting the array with particles. Either discrete sheets or a continuous moving web of material having a surface containing an array of tacky and non-tacky areas can be employed. Each tacky area of an array of tacky and non-tacky areas has a size and bonding strength suitable for adhesion of one particle thereto in formation of an array. The array is populated with conductive-particles, is useful in the precise placement of particles on contact pads of electronic devices, such as circuit boards in semiconductor applications.
An improved method for mounting particles on a surface having an array of tacky and non-tacky areas thereon, comprising the steps of:
An improved method for mounting and subsequently transferring particles on a surface having an array of tacky and non-tacky areas thereon to a substrate, comprising the steps of:
An improved method for mounting and subsequently transferring particles on a surface having an array of tacky and non-tacky areas thereon to a substrate, comprising the steps of:
Dependencies are inferred from the claim text.