Diffusion barrier and adhesive for PARMOD.TM. application to rigid printed wiring boards

A method for producing solid pure metal conductors on a substrate comprising the steps of:

• A) applying a conductor precursor in the desired pattern on to the substrate, said substrate having a coating layer of a diffusion and adhesive barrier whereby the coating layer of a diffusion and adhesive barrier is selected from the group consisting of low T.sub.g polyimides, silicones, fluorocarbons, soluble polyimides, polyimide amides, polyamic acids, or combinations thereof;
• B) heating the substrate in an oven to a critical temperature less than about 450.degree. C. for a time less than about ten minutes;
• wherein said applied conductor precursor pattern is converted into a well-consolidated, well-bonded pure metal conductor
• wherein said conductor precursor is comprised of a reactive organic medium a metal powder mixture.