Misted precursor deposition apparatus and method with improved mist and mist flow
AssigneesSymetrix Corporation, Matsushita Electronics Corporation
InventorsShinichiro Hayashi, Larry D. McMillan, Carlos A. Paz de Araujo
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Abstract
A substrate is located within a deposition chamber, the substrate defining a substrate plane. A liquid precursor is misted by ultrasonic or venturi apparatus, to produce a colloidal mist. The mist is generated, allowed to settle in a buffer chamber, filtered through a system up to 0.01 micron, and flowed into the deposition chamber between the substrate and barrier plate to deposit a liquid layer on the substrate. The liquid is dried to form a thin film of solid material on the substrate, which is then incorporated into an electrical component of an integrated circuit.
Claims10
A liquid precursor solution for use in forming metal oxides through the use of misted deposition apparatus, said liquid precursor solution comprising:
- a metal organic portion including at least one metal organic compound, said metal organic portion having a total metal content in an effective amount for yielding a solid metal compound during an anneal of a thin film of said liquid precursor solution;
- a first solvent for use in solubilizing said metal organic portion;
- and
- a thinning agent for use in reducing surface tension in said liquid precursor solution to a value ranging from 10 to 40 dynes per centimeter,
- said metal organic portion, said first solvent, and said thinning agent forming a substantially homogenous mixture.
Dependencies are inferred from the claim text.