Polishing apparatus and polishing method
AssigneeCanon Kabushiki Kaisha
InventorsMasaru Nyui, Mikichi Ban, Takehiko Suzuki, Yasushi Sugiyama
Life of this patent
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Abstract
In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.
Claims6
A thickness measuring apparatus for measuring a thickness of a surface of a material to be polished, for use in a polishing apparatus, which comprises:
- a light source for irradiating the surface of the material to be polished with momentary light;
- an image acquirer, arranged to acquire an image of the surface by the momentary light;
- and
- a thickness measurer, arranged to specify a location at which a thickness of the material to be polished is to be polished from the image and measuring the thickness at the location.
A thickness measuring method of measuring a thickness of a surface of a material to be polished which is rotating, which method comprises:
- an irradiation step of irradiating the surface of the material to be polished with momentary light;
- an image acquisition step of acquiring an image of the surface by the momentary light;
- and
- an optical measurement step of specifying a location at which a thickness of the material to be polished is to be measured from the image and measuring the thickness at the location.
Dependencies are inferred from the claim text.