Semiconductor manufacturing apparatus and command setting method
AssigneeCanon Kabushiki Kaisha
InventorsNorihiko Utsunomiya, Shigeyuki Uzawa
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AssigneeCanon Kabushiki Kaisha
InventorsNorihiko Utsunomiya, Shigeyuki Uzawa
Estimating the term…
A semiconductor manufacturing method and apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus. The apparatus includes a display device for displaying a list of the plurality of maintenance commands, a console-side control device for enabling an operator to select some of the plurality of maintenance commands displayed by the display device, to generate a maintenance menu in which some of the plurality of maintenance commands are combined as desired by the operator and to edit the maintenance menu, a storage device for storing the maintenance menu generated and edited using the console-side control device and an apparatus-side control device for successively executing the maintenance commands in the maintenance menu stored in the storage device when the apparatus-side control device receives an instruction to execute the maintenance menu.
A semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said apparatus comprising:
A semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said apparatus comprising:
A semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said apparatus comprising:
A semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said apparatus comprising:
A semiconductor manufacturing method for use with a semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said method comprising:
A semiconductor manufacturing method for use with a semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said method comprising:
A semiconductor manufacturing method for use with a semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said method comprising:
A semiconductor manufacturing method for use with a semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, by using measuring functions of the apparatus, said method comprising:
A swmiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, said apparatus comprising:
A semiconductor manufacturing method for use with a semiconductor manufacturing apparatus using a plurality of maintenance commands for automatically measuring errors caused by the apparatus or caused by a wafer treatment process, said method comprising:
Dependencies are inferred from the claim text.