Molded selective solder pallet
AssigneeMCMS, Inc.
InventorDavid A. Howell
Life of this patent
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Abstract
A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.
Claims12
A selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon which comprises:
- a mold base having an upper face and a lower face, the mold base configured to have an aperture formed through its cross-section;
- a high temperature casting material molded within the mold base and configured to have at least one recess and at least one solder flow opening.
A selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon which comprises:
- a mold base having an upper face and a lower face, the mold base configured to have an aperture formed through its cross-section;
- a high temperature casting material molded within the mold base and configured to have at least one recess and at least one solder flow opening;
- and
- a stiffening member extending across the mold base aperture made of thermoplastic resin.
Dependencies are inferred from the claim text.