Die bonding apparatus
AssigneeSharp Kabushiki Kaisha
InventorsMasao Yamazaki, Terumitsu Santo
Life of this patent
Estimating the term…
Abstract
An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.
Claims6
A die bonding apparatus comprising:
- a substrate holder for holding a chip substrate;
- pressing means for pressing a semiconductor chip on the chip substrate held by the substrate holder;
- heating means for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip;
- said heating means being disposed in the substrate holder;
- a temperature sensor for detecting a surface temperature of the pressing means, the temperature sensor comprising a first temperature sensor provided in the pressing means and a second temperature sensor provided in the substrate holder;
- and
- controlling means for controlling a heating operation of the heating means based on a temperature detected by the temperature sensor.
A die bonding apparatus comprising:
- a substrate holder for holding a chip substrate;
- pressing means for pressing a semiconductor chip on the chip substrate held by the substrate holder;
- heating means for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip;
- a temperature sensor provided at least in the pressing means, for detecting a surface temperature of the pressing means;
- and
- controlling means for controlling a heating operation of the heating means based on a temperature detected by the temperature sensor;
- wherein the heating means comprises a first heater provided in the pressing means and a second heater provided in the substrate holder,
- the temperature sensor comprising a first temperature sensor provided in the pressing means and a second temperature sensor provided in the substrate holder, and
- the controlling means controls a heating operation of the first heater based on a temperature detected by the first temperature sensor and controls a heating operation of the second heater based on a temperature detected by the second temperature sensor.
Dependencies are inferred from the claim text.