System for trimming excess material
AssigneeLucent Technologies Inc.
InventorsJoseph M. Freund, George J. Przybylek, Dennis M. Romero, Raymond F. Gruszka
Life of this patent
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Abstract
A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.
Claims16
An apparatus for trimming excess material from an assembly for handling semiconductor devices, said apparatus comprising:
- a support member adapted to support said assembly;
- a bearing surface for supporting one side of said excess material, said bearing surface residing on an outer hoop of said assembly;
- and
- a pressure applying member adapted to engage with and apply pressure to another side of said excess material, at least one of said pressure applying member and said support member being movable relative to the other.
A system for trimming excess material, said system comprising:
- a hoop assembly for supporting semiconductor products;
- a support for said hoop assembly, and wherein said hoop assembly is located on said support;
- a bearing surface for supporting one side of said excess material, said bearing surface residing on an outer hoop of said hoop assembly;
- a pressure applying member adjacent to said hoop assembly for applying pressure to said excess material;
- and
- a drive device for moving at least one of said pressure applying member and said support relative to the other.
A method of trimming excess material from a hoop assembly, said method comprising the steps of:
- loading a flexible film in said hoop assembly;
- and
- using an unsharpened edge pressure applying member against a bearing surface of an outer hoop of said hoop assembly to apply pressure to an excess portion of said flexible film.
A method of making a support for semiconductor products, said method comprising the steps of:
- loading a hoop assembly onto a support member;
- moving an unsharpened pressure applying member against a bearing surface of an outer hoop of said hoop assembly;
- and
- using said pressure applying member to trim excess material from said hoop assembly.
Dependencies are inferred from the claim text.