US 6,141,847 AGranted

Method of manufacturing composite electronic component

AssigneeMatsushita Electric Industrial Co., Ltd.

InventorsMasayuki Mizuno, Masaaki Hayama, Kazuhiro Miura, Noboru Mori, Akira Hashimoto, Mitsuteru Yamada

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Abstract

A ceramic substrate 1 made of magnetic substance on which an inductor 2 is formed is prepared. A ceramic substrate 3 made of dielectric substance on which a capacitor 4 is formed is also prepared. An intermediate layer 5 made of lass paste is printed on the inductor 2 and the capacitor 4. After debinding the substrates 1 and 3 independently, both the substrates are filed with the intermediate layer 5 therebetween so that both the substrates may be glued and integrated. As such, because the debinding process is provided before filing, less gas is generated in firing, and as a result, voids are restrained from occurring.

Claims6

Dependent claims

A manufacturing method of a composite electronic component comprising the steps of:

(a) preparing a first functional substrate comprising a plurality of first functional members formed on a first ceramic substrate,
(b) preparing a second functional substrate comprising a plurality of second functional members formed on a second ceramic substrate,
(c) applying an intermediate layer on a surface of at least one of said first and second functional substrates,
(d) independently debinding each functional substrate on which the intermediate layer has been applied,
(e) laminating said first and second functional substrates with said intermediate layer therebetween into a laminated body,
(f) firing said laminated body in order to integrate said first and second functional substrates into a fired body,
(g) cutting said fired body into pieces, and
(h) forming an outer terminal on a side face of said pieces.

5 more elements

Dependencies are inferred from the claim text.