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AssigneeMurata Manufacturing Co., Ltd.
InventorsMotoyuki Okeshi, Ken Taniguchi, Takashi Hashimoto, Makoto Irie, Hiroyuki Kawakami, Choichiro Fujii, Michinobu Maesaka, Hidemasa Iwami, Takashi Iwamoto
Estimating the term…
An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.
A method of producing a piezoelectric component including a substrate having at least one electrode disposed thereon, a piezoelectric element having first and second electrodes each disposed on one of upper and lower surfaces thereof, the piezoelectric element being mounted on said substrate, and a cap connected to said substrate so as to cover and seal said piezoelectric element, said method comprising the steps of:
A method of making a connecting structure for an electronic component, comprising the steps of:
Dependencies are inferred from the claim text.