High frequency ring gate MOSFET

A semiconductor device comprising plural unit cells formed on a semiconductor substrate,

• wherein each of said unit cells comprises:
• a ring gate electrode formed on said semiconductor substrate;
• a drain region formed in said semiconductor substrate at an inside of said gate electrode;
• a drain contact formed on said drain region;
• a source region formed in said semiconductor substrate at an outside of said gate electrode;
• a source contact formed on said source region;
• a gate contact;
• pads on which each of said gate contacts is formed respectively, said pads being formed on two portions of said semiconductor substrate with said source region interposed therebetween and formed opposite to each other;
• and
• two gate withdrawn wires connecting said gate electrode and said pads, and
• respective plane patterns of each of said unit cells have symmetrical shapes for allowing said plural unit cells to be regularly disposed on said semiconductor substrate, said semiconductor device further comprising:
• a substrate contact portion formed in a part of said semiconductor substrate;
• a substrate contact formed on said substrate contact portion;
• and
• source/substrate contact wires for connecting tips of said source contacts and said substrate contacts of said plural unit cells.

A semiconductor device comprising plural unit cells formed on a semiconductor substrate,

• wherein each of said unit cells comprises:
• a ring gate electrode formed on said semiconductor substrate;
• a drain region formed in said semiconductor substrate at an inside of said gate electrode;
• a drain contact formed on said drain region;
• a source region formed in said semiconductor substrate at an outside of said gate electrode;
• a source contact formed an said source region;
• a gate contact;
• pads on which each of said sate contacts is formed respectively, said pads being formed on two portions of said semiconductor substrate with said source region interposed therebetween and formed opposite to each other;
• and
• two gate withdrawn wires connecting said gate electrode and said pads, and
• respective plane patterns of each of said unit cells have symmetrical shapes for allowing said plural unit cells to be regularly disposed on said semiconductor substrate, said semiconductor device further comprising:
• a semiconductor region for a substrate contact provided to merely unit cells disposed at a periphery among said plural unit cells in said semiconductor substrate, said semiconductor region having a conductivity opposite to each of said source/drain regions;
• substrate contacts formed on said semiconductor region for said substrate contact;
• and
• substrate contact wires for connecting tips of said substrate contacts.

A semiconductor device comprising plural unit cells formed on a semiconductor substrate and functioning as a high frequency signal amplifier FET,

• wherein said unit cells include:
• a ring gate electrode formed on said semiconductor substrate;
• a drain region formed in said semiconductor substrate at an inside of said gate electrode;
• a drain contact formed on said drain region;
• a source region formed in said semiconductor substrate at an outside of said gate electrode and larger than said drain region;
• a source contact formed on said source region;
• an insulating film for separation formed on a portion of said semiconductor substrate adjacent to said source region;
• a gate contact;
• a pad on which said gate contact is formed, said pad being formed on said insulating film;
• and
• a gate withdrawn wire connecting said sate electrode and said pad,
• wherein said unit cells further include:
• a substrate contact;
• and
• a semiconductor region on which said substrate contact is formed, said semiconductor region having a conductivity opposite to each of said source/drain regions.

A semiconductor device comprising plural unit cells formed on a semiconductor substrate and functioning as a high frequency signal amplifier FET,

• wherein said unit cells include:
• a ring gate electrode formed on said semiconductor substrate;
• a drain region formed in said semiconductor substrate at an inside of said gate electrode;
• a drain contact formed on said drain region;
• a source region formed in said semiconductor substrate at an outside of said gate electrode and larger than said drain region;
• a source contact formed on said source region
• an insulating film for separation formed on a portion of said semiconductor substrate adjacent to said source region;
• a gate contact;
• a pad on which said gate contact:
• is formed said pad being formed on said insulating film;
• and
• a gate withdrawn wire connecting said -gate electrode and said pad,
• wherein said source region is provided with a pattern of regular polygon which has a cut-off portion in a plan view;
• said insulating film extends to said cut-off portion;
• and said gate withdrawn wire passes over said cut-off portion and is connected with said pad.

A semiconductor device comprising plural unit cells formed on a semiconductor substrate,

• wherein each of said unit cells comprises:
• a ring gate electrode formed on said semiconductor substrate;
• a drain region formed in said semiconductor substrate at an inside of said gate electrode;
• a drain contact formed an said drain region;
• a source region formed in said semiconductor substrate at an outside of said gate electrode;
• a source contact formed on solid source region;
• a gate contact;
• pads on which each of said gate contacts is formed- respectively, said pads being formed on two portions of said semiconductor substrate with said source region interposed therebetween and formed opposite to each other;
• and
• two gate withdrawn wires connecting said pate electrode and said pads, and
• respective plane patterns of each of said unit cells have symmetrical shapes for allowing said plural unit cells to be regularly disposed on said semiconductor substrate, said semiconductor device further comprising:
• a substrate contact;
• and
• a semiconductor region on which said substrate contact is respectively formed, said semiconductor region being formed on two portions of said semiconductor substrate with said source region interposed therebetween, being formed opposite to each other, and having a conductivity opposite to each of source/drain regions.