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US 6,136,175 AGranted
Method of producing an electronic component, in particular a surface acoustic wave component
AssigneeSiemens Aktiengesellschaft
InventorsAlois Stelzl, Hans Kruger, Wolfgang Pahl, Jurgen Machui
Life of this patent
Estimating the term…
Abstract
The electronic component, specifically a SAW component with conductive structures disposed on a substrate is encapsulated for protection against environmental influences. The electrically conductive structures are sealed with a gas diffusion-constricting protective layer formed with an electrochemical or ion bombardment process.
Claims9
A method of producing an electronic component, which comprises:
- providing electrically conductive surface acoustic wave structures on a surface of a substrate;
- forming a gas diffusion-constricting protective layer formed of an oxide on the conductive surface acoustic wave structures by a process selected from the group consisting of electrochemical coating and ion bombardment;
- encapsulating the conductive surface acoustic wave structures and the protective layer with an encapsulation applied on the substrate and sealing the conductive structures;
- and
- saturating reactive groups in the protective layer with metal-organic compounds.
2 more elements
A method of producing an electronic component, which comprises:
- providing electrically conductive surface acoustic wave structures on a surface of a substrate;
- forming a gas diffusion-constricting protective layer formed of an oxide of the conductive surface acoustic wave structures material on the conductive surface acoustic wave structures by a process selected from the group consisting of electrochemical coating and ion bombardment, saturating reactive groups in the protective layer with metal-organic compounds;
- and
- encapsulating the conductive surface acoustic wave structures and the protective layer with an encapsulation applied on the substrate and sealing the conductive structures, the conductive structures have contact pads for electrically connecting the electronic component, and the method further comprises forming an additional protective layer on the substrate and on the protective layer and covering, with the additional protective layer, the conductive structures except for the contact pads.
1 more element
A method of producing an electronic component, which comprises:
- providing electrically conductive structures on a surface of a substrate wherein the conductive structures have contact pads for electrically connecting the electronic component;
- forming a gas diffusion-constricting protective layer on the conductive structures by a process selected from the group consisting of electrochemical coating and ion bombardment;
- encapsulating the conductive structures and the protective layer with an encapsulation applied on the substrate and sealing the conductive structures;
- and
- applying an organic polymer on the protective layer forming an additional protective layer on the substrate and on the protective layer and covering the conductive structures except for the contact pads.
2 more elements
A method of producing an electronic component, which comprises:
- providing electrically conductive structures on a surface of a substrate;
- forming a gas diffusion-constricting protective layer on the conductive structures by a process selected from the group consisting of electrochemical coating and ion bombardment;
- saturating reactive groups in the protective layer with metal-organic compounds;
- and
- encapsulating the conductive structures and the protective layer with an encapsulation applied on the substrate and sealing the conductive structures.
2 more elements
Dependencies are inferred from the claim text.