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AssigneeUnitka Ltd.
InventorsHisayasu Kaneshiro, Jushiro Eguchi, Yoshiaki Echigo, Takahiro Ono
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A polyimide precursor solution having a high concentration yet low viscosity, a polyimide coating film having satisfactory physical properties which is prepared from the polyimide precursor solution, and a process for producing a polyimide coating film using the polyimide precursor solution. The polyimide precursor solution has dissolved therein a specific salt of a diamine and a tetracarboxylic acid and/or a dicarboxylic acid-dialkyl ester in a high concentration, the diamine and the tetracarboxylic acid and/or the dicarboxylic acid-dialkyl ester being capable of forming a polyimide. Also disclosed is a polyimide coating film obtained by heating the solution to cause imidization and a process for producing the polyimide coating film.
A polyimide precursor solution which forms polyimide on imidization, comprising a solvent and a solute dissolved in the solvent, said solute comprising, in a concentration of 50% by weight or more of the solution, a salt comprising an aromatic diamine and an aromatic tetracarboxylic acid and/or an aromatic dicarboxylic acid-dialkyl ester, wherein said solution has a viscosity of 20 poise or less, wherein said aromatic diamine is selected from the group consisting of ##STR12##
Dependencies are inferred from the claim text.