Micro-electro-mechanics systems (MEMS)
OwnerDan Haronianinventor
Life of this patent
Estimating the term…
Abstract
A microelectronics deformation sensor including at least one stress sensor directly integrated on at least one of an extremity of a supported deformable structure and a support of the deformable structure, the deformable structure being constructed of a single crystal material, the at least one stress sensor sensing a stress in a vicinity of the extremity and thereby sensing a deformation of the deformable structure.
Claims27
A microelectronics deformation sensor comprising:
- at least one stress sensor directly integrated on an extremity of a support of a deformable structure, said deformable structure being constructed of a single crystal material and having a reference plane, said deformable structure deforming in-plane relative to said reference plane, said at least one stress sensor sensing a stress in a vicinity of said extremity of said support and thereby quantitatively detecting a deformation of said deformable structure.
A microelectronics deformation sensor comprising:
- at least one stress sensor directly integrated on an extremity of a support of a deformable structure said deformable structure being constructed of a polysilicon and having a reference plane, said deformable structure deforming in-plane relative to said reference plane, said at least one stress sensor sensing a stress in a vicinity of said extremity of said support and thereby quantitatively detecting a de formation of said deformable structure.
A method for sensing deformation of a microelectromechanic systems (MEMS), comprising the steps of:
- directly integrating at least one stress sensor on an extremity of a support of a deformable structure of said MEMS, said deformable structure being constructed of a single crystal material and having a reference plane, said deformable structure deforming in-plane relative to said reference plane;
- and
- sensing a stress in a vicinity of said extremity of said support with said at least one stress sensor, thereby quantitatively detecting a deformation of said deformable structure.
A method for sensing deformation of a microelectromechanic systems (MEMS), comprising the steps of:
- directly integrating at least one stress sensor on an extremity of a support of a deformable structure of said MEMS, said deformable structure being constructed of a polysilicon and having a reference plane, said deformable structure deforming in-plane relative to said reference plane;
- and
- sensing a stress in a vicinity of said extremity of said support with said at least one stress sensor, thereby quantitatively detecting a deformation of said deformable structure.
Dependencies are inferred from the claim text.