Method and system for adjusting semiconductor processing equipment

A method of adjusting a multi-zone temperature control system for an integrated circuit fabrication tool, comprising:

• loading a monitor substrate within the tool, the tool having a plurality of temperature control zones associated with a corresponding plurality of heating elements and at least one temperature controller;
• forming a test layer on the monitor substrate within the tool while controlling the heating elements with the at least one temperature controller;
• determining interference colors from the test layer in a plurality of substrate zones corresponding to the temperature control zones;
• correlating the interference colors in each substrate zone with a difference in substrate zone temperature while forming the test layer;
• and
• adjusting the at least one temperature controller with adjustments corresponding to the correlated differences in temperature.

A method of preparing a color-to-temperature adjustment reference, comprising;

• depositing a test layer on a monitor work piece within a processing chamber under a set of deposition conditions calculated for a target test layer thickness;
• identifying a first region of the test layer having a first color;
• measuring a first thickness of the test layer within the first region;
• calculating a first temperature controller adjustment for achieving the target test layer thickness within the first region of the test layer;
• and
• correlating the first color with the first temperature controller adjustment on the reference.