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US 6,121,358 AGranted
Hydrophobic vinyl monomers, formulations containing same, and uses therefor
AssigneeThe Dexter Corporation
InventorsStephen M. Dershem, Jose A. Osuna, Jr.
Life of this patent
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Abstract
In accordance with the present invention, there are provided compositions based on defined hydrophobic vinyl monomers have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).
Claims80
A die-attach paste comprising:
- in the range of about 10 up to about 80 wt % of a thermosetting resin composition, and
- in the range of about 20 up to about 90 wt % of a conductive filler,
- wherein said thermosetting resin composition comprises:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR29## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.;
- wherein at least one such compound of structure I is selected from the group consisting of 4,8-bis(acryloxymethyl)-tricyclo[5.2.1.0.sup.2,6 ]decane, the diacrylate of perhydro bisphenol A, 4,8-bis(paravinylphenol)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-bis(paravinyl hydroxymethyl benzene)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-divinyl ester of tricyclo[5.2.1.0.sup.2,6 ]decane, and a compound of the following structure:
- ##STR30## wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C., and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide a desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, up to about 75 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR31## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, up to about 60 wt % of at least one polyunsaturated comonomer other than the polyvinyl compounds of (a), based on the total weight of the composition;
- and
- (e) optionally, a diluent.
12 more elements
A composition useful for protecting a solder interconnection between a semiconductor device and a supporting substrate, said composition comprising:
- in the range of about 20 up to about 80 wt % of a curable thermosetting polyvinyl-based binder system, wherein said binder system has a viscosity at room temperature of no greater than about 2,500 centipoise, and
- in the range of about 20 up to about 80 wt % of a filler having a maximum particle size of about 50 microns,
- wherein wt % is based on the total weight of the composition unless otherwise indicated,
- wherein said binder system comprises:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR32## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.;
- wherein at least one such compound of structure I is selected from the group consisting of 4,8-bis(acryloxymethyl)-tricyclo[5.2.1.0.sup.2,6 ]decane, the diacrylate of perhydro bisphenol A, 4,8-bis(paravinylphenol)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-bis(paravinyl hydroxymethyl benzene)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-divinyl ester of tricyclo[5.2.1.0.sup.2,6 ]decane, and a compound of the following structure:
- ##STR33## wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C., and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, in the range of about 5 up to about 95 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR34## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, in the range of about 1.0 up to about 60 wt % of at least one polyunsaturated comonomer, based on the total weight of the composition;
- and
- (e) optionally, a diluent.
13 more elements
An article comprising a circuit board having a solder mask deposited thereon, wherein said solder mask is prepared from a composition comprising:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR35## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.;
- wherein at least one such compound of structure I is selected from the group consisting of 4,8-bis(acryloxymethyl)-tricyclo[5.2.1.0.sup.2,6 ]decane, the diacrylate of perhydro bisphenol A, 4,8-bis(paravinylphenol)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-bis(paravinyl hydroxymethyl benzene)-tricyclo[5.2.1.0.sup.2,6 ]decane, 4,8-divinyl ester of tricyclo[5.2.1.0.sup.2,6 ]decane, and a compound of the following structure:
- ##STR36## wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C., and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, in the range of about 5 up to about 75 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR37## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, in the range of about 1.0 up to about 60 wt % of at least one polyunsaturated comonomer, based on the total weight of the composition;
- and
- (e) optionally, a diluent.
9 more elements
A composition useful for protecting a solder interconnection between a semiconductor device and a supporting substrate, said composition comprising:
- in the range of about 20 up to about 80 wt % of a curable thermosetting polyvinyl-based binder system, wherein said binder system has a viscosity at room temperature of no greater than about 2,500 centipoise, and
- in the range of about 20 up to about 80 wt % of a filler having a maximum particle size of about 50 microns,
- wherein wt % is based on the total weight of the composition unless otherwise indicated,
- wherein said binder system comprises:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR39## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C., wherein at least one compound of structure I is the diacrylate of 10,11-dioctyl-1,20-eicosane, and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, in the range of about 5 up to, about 95 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR40## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, in the range of about 1.0 up to about 60 wt % of at least one polyunsaturated comonomer, based on the total weight of the composition;
- and
- (e) optionally, a diluent.
12 more elements
A die-attach paste comprising:
- in the range of about 10 up to about 80 wt % of a thermosetting resin composition, and
- in the range of about 20 up to about 90 wt % of a conductive filler,
- wherein said thermosetting resin composition comprises:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR42## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C.;
- wherein at least one such compound of structure I is the diacrylate of 10,11-dioctyl-1,20-eicosane, and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide a desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, up to about 75 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR43## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, up to about 60 wt % of at least one polyunsaturated comonomer other than the polyvinyl compounds of (a), based on the total weight of the composition;
- and
- (e) optionally, a diluent.
12 more elements
An article comprising a circuit board having a solder mask deposited thereon, wherein said solder mask is prepared from a composition comprising:
- (a) at least two polyvinyl compounds of structure I as follows:
- ##STR45## wherein X is a hydrophobic bridging group having in the range of about 7 up to about 400 carbon atoms, and R is H or methyl,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .gtoreq.about 100.degree. C.,
- wherein a homopolymer formed from at least one compound of structure I has a T.sub.g .ltoreq.about 0.degree. C.;
- wherein at least one such compound of structure I is the diacrylate of 10,11-dioctyl-1,20-eicosane, and
- wherein the ratio of said polyvinyl compounds of structure I is sufficient to provide desirable balance of high and low temperature die shear strength, flexibility and toughness;
- (b) optionally, in the range of about 5 up to about 75 wt % of a monovinyl counterpart of a compound of structure I, having the structure II as follows:
- ##STR46## wherein R and X are as defined above;
- (c) in the range of about 0.1 up to about 3 wt % of at least one free radical initiator, based on the total weight of the composition;
- (d) optionally, in the range of about 1.0 up to about 60 wt % of at least one polyunsaturated comonomer, based on the total weight of the composition;
- and
- (c) optionally, a diluent.
9 more elements
Dependencies are inferred from the claim text.