Heatspreader for a flip chip device, and method for connecting the heatspreader

A circuit board assembly, comprising:

• an integrated circuit package, comprising:
• a first substrate having first and second surfaces, each surface having a plurality of terminal pads,
• an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate, and
• a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the first surface of the first substrate by a second thermal interface material;
• and
• a second substrate having a plurality of terminal pads, the terminal pads of the second substrate being connected to the terminal pads of the second surface of the first substrate,
• wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases.

A circuit assembly, comprising:

• an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections connectable to a plurality of terminal pads on a substrate;
• and
• a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connectable to the substrate by a second thermal interface material,
• wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases when the legs interface with a substrate.

A circuit assembly, comprising:

• a substrate having a plurality of terminal pads;
• an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the substrate;
• and
• a heatspreader plate having at least four legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each leg connected to the substrate by a second thermal interface materials.

A circuit board assembly, comprising:

• an integrated circuit package, comprising:
• a first substrate having first and second surfaces, each surface having a plurality of terminal pads,
• an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate, and
• a heatspreader plate having at least four legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the first surface of the first substrate by a second thermal interface material;
• and
• a second substrate having a plurality of terminal pads, the terminal pads of the second substrate being connected to the terminal pads of the second surface of the first substrate.