Patterned molecular self-assembly

A process for preparing a multi-patterned molecular self-assembly, the process comprising the sequential steps of:

• a) providing a support having a surface;
• b) forming a first pattern on the support wherein a first portion of the surface of the support is exposed;
• c) selectively adsorbing a first compound on the first exposed portion of the surface of the support;
• d) selectively adsorbing a second compound on the first compound to form a first bilayer;
• e) applying an inert compound to the first bilayer;
• f) patterning the support a second time to expose a second portion of the surface of the support;
• g) selectively adsorbing a third compound on the exposed second portion of the surface of the support;
• and
• h) selectively adsorbing a fourth compound on the third compound to form a second bilayer.

A process for preparing a patterned molecular self-assembly, the process comprising the sequential steps of:

• a) providing single crystal silicon support having a surface;
• b) applying a photoresist to the surface of the single crystal silicon support;
• c) masking the support;
• d) exposing the support to ultraviolet light;
• e) removing the mask to yield a patterned single crystal silicon support exposed surface and a surface covered with the photoresist;
• f) applying a reactive oligomer solution to the first exposed surface;
• g) removing the photoresist to expose a second surface of the support;
• h) selectively adsorbing a first compound to the exposed second surface of the support;
• i) selectively adsorbing a second compound on the first compound to form a bilayer;
• and
• j) repeating steps (h) and (i) to form a multi-layered patterned molecular self-assembly.

A process for preparing a multi-patterned molecular self-assembly, the process comprising the sequential steps of:

• a) providing a single crystal silicon support having a surface;
• b) applying a photoresist to the surface of the single crystal silicon support;
• c) masking the support;
• d) exposing the support to ultraviolet light;
• e) removing the mask to yield a patterned single crystal silicon support having a first exposed surface and a surface covered with the photoresist;
• f) selectively adsorbing a first compound on the first exposed surface of the support;
• g) selectively adsorbing a second compound on the first compound to form a first bilayer;
• h) repeating steps (f) and (g) to form a first multi-layered, patterned molecular self-assembly;
• I) masking the substrate and the first multi-layered, patterned molecular self-assembly;
• j) exposing the substrate to ultraviolet light;
• k) removing the mask to yield a second exposed surface of the support;
• l) selectively adsorbing a third compound on the second exposed surface of the support;
• m) selectively adsorbing a fourth compound on the third compound to form a second bilayer;
• n) repeating steps (l) and (m) to form a second multi-layered, patterned molecular self-assembly;
• and
• o) removing the photoresist from the substrate to yield a multi-patterned, multi-layered molecular self-assembly.