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AssigneeHitachi, Ltd.
InventorsAkira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii, Masanori Segawa, Hiroyoshi Kokaku, Ryo Moteki, Ichiro Anjoh
Estimating the term…
A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
A laminate capable of mounting one or more semiconductor elements thereon, comprising an insulating layer exhibiting a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.degree.-300.degree. C.,
A prepreg comprising a resin portion of a sea-island structure and a woven reinforcement impregnated with said resin portion, said prepreg exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.degree.-300.degree. C., said resin portion comprising a first resin and an organic compound filler dispersed in said first resin, said organic compound filler forming with said first resin a phase separation structure as said sea-island structure.
A memory card comprising a circuit board and a memory device mounted on said circuit board, wherein said circuit board comprises an insulating layer exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.degree.-300.degree. C.,
A resin encapsulated semiconductor device, comprising:
Dependencies are inferred from the claim text.