US 6,113,836 AGranted

Method of forming thick film pattern and material for forming thick film pattern

AssigneeDai Nippon Insatsu Kabushiki Kaisha

InventorsYorihiko Sakai, Norikatsu Ono, Norikazu Mineo, Takeshi Matsumoto, Hideaki Fujii

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Abstract

A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.

Claims2

Dependent claims

In a method of forming a thick film pattern of ceramic material on a supporting substrate, the method comprising the steps of:

coating ultraviolet curing resin on an original plate having a concave-convex surface corresponding to a desirable pattern;
providing and extending a substrate film on said ultraviolet curing resin;
forming a tentative female mold having a groove with a desirable pattern on said substrate film after curing said ultraviolet curing resin by ultraviolet rays and removing the same from said original plate;
causing said tentative female mold carrying said substrate film to adhere to said substrate in such a manner that said groove is in confrontation with said supporting substrate;
removing the upper portion of said tentative female mold after removing said substrate film from said tentative female mold to define a final female mold having a desirable pattern with upwardly open spaces on said supporting substrate;
filling said ceramic material in only the upwardly open spaces formed in said final female mold;
and
calcining to cause said final female mold to vanish.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/100,974Filed 22 Jun 1998 · division
Priority: JP 2-1543125 Jan 1990
Granted: 5 Sep 2000
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10W 70/098
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: applying pastes or inks, e.g. screen printing
G03F 7/0017
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g.…
H05K 3/1258
Using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or…
H10D 84/01
Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers:…

Family

Serial762,008Parent of this division · filed 19 Sep 1991
Serial694,025Parent of this division · filed 8 Aug 1996
US 5,814,267 AParent of this division
US 5,580,511 AParent of this division
US 6,113,836 AThis patent

From the US filing history. Foreign family members aren’t listed.