Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

A semiconductor device comprising:

• a semiconductor element;
• a semiconductor element mounting substrate having a first surface mounted with said semiconductor element, said semiconductor element mounting substrate comprising a single member having a substantially flat shape and a substantially uniform thickness, without any bends thereupon, said semiconductor element being mounted directly to said semiconductor element mounting substrate via a die bonding material;
• a flexible wiring substrate wrapped around said semiconductor element mounting substrate, said flexible wiring substrate including a flexible base member, electrode portions formed on said base member and electrically connected to said semiconductor element, external connecting terminal portions formed on said base member and electrically connectable to an outside member, and wiring portions formed on said base member and electrically connecting said electrode portions and said external connecting terminal portions;
• and
• a resin encapsulating at least said semiconductor element;
• said external connecting terminal portions comprising mechanical bumps.

A semiconductor device comprising:

• a semiconductor element;
• a semiconductor element mounting substrate having a first surface mounted with said semiconductor element, said semiconductor element mounting substrate comprising a single member having a surface area which is substantially larger than a surface area of the semiconductor element, and having a substantially uniform thickness, without any bends thereupon, said semiconductor element being mounted directly to said semiconductor element mounting substrate via a die bonding material;
• a flexible wiring substrate wrapped around said semiconductor element mounting substrate, said flexible wiring substrate including a flexible base member, electrode portions formed on said base member and electrically connected to said semiconductor element, external connecting terminal portions formed on said base member and electrically connectable to an outside member, and wiring portions formed on said base member and electrically connecting said electrode portions and said external connecting terminal portions;
• and
• a resin encapsulating at least said semiconductor element;
• said external connecting terminal portions projecting from said base member.

A semiconductor device comprising:

• a semiconductor element;
• a semiconductor element mounting substrate having a first surface mounted with said semiconductor element, said semiconductor element mounting substrate comprising a single member having a substantially flat shape and a substantially uniform thickness without any bends thereupon;
• a flexible wiring substrate wrapped around said semiconductor element mounting substrate, said flexible wiring substrate including a flexible base member, electrode portions formed on said base member and electrically connected to said semiconductor element, external connecting terminal portions formed on said base member and electrically connectable to an outside member, and wiring portions formed on said base member and electrically connecting said electrode portions and said external connecting terminal portions;
• and
• a resin encapsulating at least said semiconductor element;
• said external connecting terminal portions projecting from said base member;
• wherein said electrode portions formed on said base member are electrically connected to the semiconductor element by wire-bonded wires.

A semiconductor device comprising:

• a semiconductor element;
• a semiconductor element mounting substrate having a first surface mounted with said semiconductor element, said semiconductor element mounting substrate comprising a single member having a surface area which is substantially larger than a surface area of the semiconductor element, and having a substantially uniform thickness without any bends thereupon;
• a flexible wiring substrate wrapped around said semiconductor element mounting substrate, said flexible wiring substrate including a flexible base member, electrode portions formed on said base member and electrically connected to said semiconductor element, external connecting terminal portions formed on said base member and electrically connectable to an outside member, and wiring portions formed on said base member and electrically connecting said electrode portions and said external connecting terminal portions;
• and
• a resin encapsulating at least said semiconductor element;
• said external connecting terminal portions projecting from said base member, wherein said electrode portions formed on said base member are electrically connected to the semiconductor element by wire-bonded wires.