Article comprising molded circuit
AssigneeLucent Technologies Inc.
InventorsRobert L. Decker, John D. Weld
Life of this patent
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Abstract
An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.
Claims18
A molded circuit comprising:
- at least a first thermoplastic polymeric material layer and a second thermoplastic polymeric material layer;
- said first thermoplastic polymeric material layer is an electrically insulating material having a volume resistivity of greater than about 10.sup.13 ohm-centimeter;
- and
- said second thermoplastic polymeric material layer is an electrically conductive material having a volume resistivity of less than about 2.0 ohm-centimeter, said second thermoplastic polymeric material layer has a composition in which conductive fibers are suspended within a thermoplastic polymeric material, said conductive fibers are present in an amount of at least about 6% by weight and no greater than about 25% by weight of said thermoplastic polymeric material and said fibers have an aspect ratio in the range of about 100:1 to about 2000:1,
- wherein said second thermoplastic polymeric material layer provides a path for an electrical current in said molded circuit.
A molded circuit comprising:
- at least a first thermoplastic polymeric material layer and a second thermoplastic polymeric material layer;
- said first thermoplastic polymeric material layer is an electrically insulating material having a volume resistivity of greater than about 10.sup.13 ohm-centimeter;
- and
- said second thermoplastic polymeric material layer is an electrically conductive material having a volume resistivity of less than about 2.0 ohm-centimeter,
- wherein said second thermoplastic polymeric material layer provides a path for an electrical current in said molded circuit and is formed using multi-shot injection molding.
Dependencies are inferred from the claim text.