Test apparatus for electronic components
AssigneeTrio-Tech International
InventorsSimon Costello, Louis Ryan, Paul Pham, Mircea Motora
Life of this patent
Estimating the term…
Abstract
A test apparatus (1) has a temperature controlled chuck (8) which provides good mechanical stability across a wide temperature range. This significantly reduces the number of times the probes (9) must be re-positioned, and in some cases eliminates such re-positioning. The chuck (8) has a support plate (20) which is connected to a base plate (35) by pillars (40) which have a low thermal expansion coefficient. This limits thermal expansion between the support plate (20) and the base plate (35). In addition, the heat transfer means is mounted so that thermal expansion is accommodated internally.
Claims25
A temperature controlled chuck for a test apparatus for testing electronic devices, the chuck comprising:
- a support plate having a device-contacting upper surface;
- a base plate mounted below the support plate;
- means for connecting the base plate to a test apparatus;
- a connector having a low thermal expansion coefficient interconnecting the base plate and the support plate to provide a rigid structure of the support plate, the connector, and the base plate;
- heat transfer means mounted between the support plate and the base plate;
- cooling means between the base plate and the heat transfer means comprising a hollow body connected by cooling tubes to a cooling system;
- and
- mounting means for the heat transfer means comprising means for accommodating expansion of the heat transfer means internally within the rigid structure.
A temperature controlled chuck for a test apparatus for testing electronic devices, the chuck comprising:
- a support plate having a device-contacting upper surface;
- a base plate mounted below the support plate;
- means for connecting the base plate to a test apparatus;
- a connector having a low thermal expansion coefficient interconnecting the base plate and the support plate to provide a rigid structure;
- heat transfer means mounted between the base plate and the support plate;
- cooling means between the base plate and the heat transfer means comprising a hollow body connected by cooling tubes to a cooling system;
- and
- mounting means for the heat transfer means, said mounting means comprising a deformable part of the base plate supporting the heat transfer means whereby the deformable part distorts locally upon thermal expansion of the heat transfer means without causing distortion of the rigid structure.
A temperature controlled chuck for a test apparatus for testing electronic devices, the chuck comprising:
- a support plate having a device-contacting upper surface;
- a base plate mounted below the support plate;
- means for connecting the base plate to a test apparatus;
- a connector having a low thermal expansion coefficient interconnecting the base plate and the support plate to provide a rigid structure;
- heat transfer means mounted between the base plate and the support plate;
- cooling means between the base plate and the heat transfer means comprising a hollow body connected by cooling tubes to a cooling system;
- and
- mounting means for the heat transfer means, said mounting means comprising a resilient part of the heat transfer means for accommodating, by compression, expansion of other parts of the heat transfer means internally within the rigid structure.
A temperature controlled chuck for a test apparatus for testing electronic devices, the chuck comprising:
- a support plate having a device-contacting upper surface;
- a base plate mounted below the support plate;
- means for connecting the base plate to a test apparatus;
- a connector having a low thermal expansion coefficient interconnecting the base plate and the support plate to provide a rigid structure of the support plate, the connector, and at least part of the base plate;
- heat transfer means mounted between the support plate and the base plate;
- cooling means between the base plate and the heat transfer means comprising a hollow body connected by cooling tubes to a cooling system;
- and
- mounting means for the heat transfer means comprising means for accommodating expansion of the heat transfer means internally within the rigid structure, and wherein the mounting means and the connector have a high electrical impedance, in excess of 10.sup.12 Ohms.
A temperature controlled chuck for a test apparatus for testing electronic devices, the chuck comprising:
- a support plate having a device-contacting upper surface,
- a base plate mounted below the support plate;
- means for connecting the base plate to a test apparatus;
- a connector having a low thermal expansion coefficient and comprising a set of pillars interconnecting the base plate and the support plate to provide a rigid structure;
- heat transfer means mounted between the support plate and the base plate;
- cooling means between the base plate and the heat transfer means comprising a hollow body connected by cooling tubes to a cooling system;
- and
- a resilient mounting means supporting the heat transfer means in spaced-apart relationship with the base plate for accommodating expansion of the heat transfer means internally within the rigid structure.
Dependencies are inferred from the claim text.