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US 6,104,002 AGranted
Heat treating apparatus
AssigneeTokyo Electron Limited
InventorsOsamu Hirose, Kiyohisa Tateyama
Life of this patent
Estimating the term…
Abstract
A substrate heat treating apparatus with a substrate support plate having a plurality of holes, a heating element to heat the substrate through the support plate, and substrate support pins extending through the plurality of holes in the support plate. Each support pin is mounted so that it is slidable in a horizontal direction within each of the plurality of holes in the support plate.
Claims9
A heat treating apparatus for baking a coating film on a large substrate, comprising:
- a support plate for supporting a substrate to be treated, said support plate having a plurality of holes;
- heating means for heating said substrate through said support plate;
- and
- support pins extending through said plurality of holes of said support plate so as to support said substrate, each of said support pins having a leg portion slidably mounted on said support plate, wherein each of said support pins is slidable in a horizontal direction within each hole of said plurality of holes in said support plate.
1 more element
Dependencies are inferred from the claim text.