Reverse linear polisher with loadable housing
AssigneeNutool, Inc.
InventorHomayoun Talieh
Life of this patent
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Abstract
The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad as the pad moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having a novel wafer loading and unloading method.
Claims18
A chemical mechanical polishing device for polishing a surface of a semiconductor wafer, comprising:
- a wafer housing adapted to support the wafer;
- and
- a polishing station having a pad that polishes the surface of the wafer with bi-directional linear movement.
A method of polishing a surface of a semiconductor wafer, the method comprising the steps of:
- supporting the wafer such that the surface of the wafer is exposed to a polishing pad;
- and
- polishing the surface of the wafer by moving the polishing pad bidirectional linearly.
A method of polishing a surface of a semiconductor wafer, the method comprising the steps of:
- chemical mechanical polishing of the surface of the wafer using a pad moving in a first direction at a predetermined speed;
- and
- chemical mechanical polishing of the surface of the wafer using the pad in a second direction opposite the first direction with the pad moving at the predetermined speed, the predetermined speed being between 100 to 600 feet per minute.
Dependencies are inferred from the claim text.