Diffusion bonding apparatus for pipes
AssigneeDaido Tokushuko Kabushiki Kaisha
InventorsMasaki Tsuchiya, Takao Shimizu
Life of this patent
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Abstract
A diffusion bonding apparatus for pipes that are supplied downward from above comprising a lower block for holding a lower pipe and an upper block for holding and pressing an upper pipe against the lower pipe. In the apparatus, three or more hydrraulic cylinders are provided in a lifting member of the upper block about a joint where the upper pipe is held in such manner that the cylinders are located in a circumference of a circle.
Claims10
A diffusion bonding apparatus for pipes that are supplied downward from above, comprising a lower block for holding a lower pipe and an upper block for holding and pressing an upper pipe against the lower pipe,
- wherein three or more hydraulic cylinders are provided in a lifting member of the upper block about a position where the upper pipe is held in such manner that the cylinders are located in a circumference of a circle.
Dependencies are inferred from the claim text.