Method of dicing wafer level integrated multiple optical elements
AssigneeDigital Optics Corporation
InventorsBrian Harden, Alan Kathman, Michael Feldman
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Abstract
Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
Claims15
A method for forming an optical element comprising:
- providing a bonding material surrounding each first optical element in an array of first optical elements on a first wafer;
- aligning a second wafer with said first wafer;
- treating the bonding material to thereby bond the aligned wafers;
- and
- dicing the bonded wafers using a dicing slurry, each resulting bonded die containing at least one optical element wherein each resulting die is protected during dicing from the slurry by the bonding material.
Dependencies are inferred from the claim text.