Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
AssigneeDisco Corporation
InventorsWittenzellner Elmar, Kenichi Sekiya
Life of this patent
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Abstract
Disclosed are improved apparatus and method for effecting a required machining on workpieces with working liquid flushing to the tool-and-workpiece contacting place. Gas such as air is ejected to the tool-and-workpiece contacting place, thereby making the working liquid to forcedly invade into the tool-and-workpiece interface. Thus, cooling effect is enhanced to maximum while saving the quantity of working liquid, still assuring that the products of comparable or even higher quality are provided.
Claims1
A method for grinding of a semiconductor wafer in which a required grinding is effected by using a machining apparatus comprising a holding means for holding the semiconductor wafer to be ground, a machining means having a whetstone put in contact with the semiconductor wafer held by the holding means for effecting a required grinding, working water supplying means for directing a working water to the place at which the whetstone is put in contact with the semiconductor wafer, at a contacting area, and gas ejecting means for ejecting a gas toward the semiconductor wafer, wherein the method comprises the steps of:
- disposing a gas ejection nozzle of the gas ejecting means in the direction toward the whetstone and semiconductor wafer contacting area:
- directing the working water to the place at which the whetstone is put in contact with a surface of the semiconductor wafer and
- simultaneously ejecting the gas from the gas ejection nozzle in such a way that the gas, in a stream of high-pressure, gas may push the working water forcedly through the whetstone and semiconductor wafer contacting area.
Dependencies are inferred from the claim text.