Substrate forming mold, and plate thickness adjusting method of formed substrate in substrate forming mold
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuo Inoue, Yoshihiro Kawasaki
Life of this patent
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Abstract
A substrate forming mold for forming a substrate by filling a cavity formed between a pair of matching molds 1, 2 with resin, that is, this substrate forming mold has shims 9, 12 disposed at least between a mirror finished surface plate 6 for composing one mold 1 and a stable mold base 8, and in a region inside of a fixed abutting ring 13, depending on fluctuations of plate thickness of formed substrate. As a result, the plate thickness of formed substrate can be adjusted finely, and fluctuations occurring in the radial direction or peripheral direction of the formed substrate can be decreased.
Claims28
A substrate forming mold comprising:
- a plurality of substrate forming members for forming a substrate,
- a fixed base for holding a first substrate forming member of said plurality of substrate forming members,
- a moveable base for holding a second substrate forming member of said plurality of substrate forming members,
- a plurality of abutting members each having an inner portion, a first of said plurality of abutting members provided on said fixed base and a second of said plurality of said abutting members provided on said moveable base, said plurality of abutting members disposed for substantially enclosing said first and second substrate forming members, said first and second abutting members abutting against each other to produce a specified gap for forming said substrate between said first and said second substrate forming members, and
- gap adjusting means disposed between said first substrate forming member and said fixed base and/or between said second substrate forming member and said moveable base, disposed within said inner portion of said abutting members, and adapted for separately adjusting local sections of said gap.
A method for adjusting the plate thickness of a substrate formed within a substrate forming mold, said method comprising:
- a) providing a pair of substrate forming members for forming a substrate;
- b) providing a fixed base secured to a first substrate forming member out of said pair of substrate forming member;
- c) providing a movable base secured to a second substrate forming member of said pair of substrate forming members;
- d) providing a pair of abutting members, each including an inner portion;
- e) affixing one of said pair of abutting members to said fixed base;
- f) affixing the other of said pair of said abutting members to said movable base, said substrate forming members enclosed within said pair of abutting members;
- g) positioning said pair of abutting members to produce a gap between the set of substrate forming members, said pair of abutting members abutting against each other;
- h) providing gap adjusting means disposed between said first substrate forming member and said fixed base and/or between said second substrate forming member and said movable base, disposed within said inner portion of said abutting members, and adapted for separately adjusting local sections of said gap;
- and
- i) adjusting said gap.
A method for adjusting the plate thickness of a substrate formed within a substrate forming mold, said substrate forming mold comprising:
- a plurality of substrate forming members for forming a substrate,
- a fixed base for holding a first substrate forming member of said plurality of substrate forming members,
- a moveable base for holding a second substrate forming member of said plurality of substrate forming members, and
- a plurality of abutting members each having an inner portion, a first of said plurality of abutting members provided on said fixed base and a second of said plurality of said abutting members provided on said moveable base, said plurality of abutting members disposed for substantially enclosing said first and second substrate forming members, said first and second abutting members abutting against each other to produce a specified gap for forming said substrate between said first and said second substrate forming members;
- said method comprising:
- a) providing gap adjusting means disposed between said first substrate forming member and said fixed base and/or between said second substrate forming member and said moveable base, disposed within said inner portion of said abutting members, and adapted for separately adjusting local sections of said gap;
- and
- b) adjusting said gap.
Dependencies are inferred from the claim text.