Radio frequency identification tag having printed circuit interconnections
AssigneeMotorola, Inc.
InventorsNoel H. Eberhardt, Philip R. Wright
Life of this patent
Estimating the term…
Abstract
A radio frequency identification tag (100) includes a radio frequency identification tag circuit chip (112) bonded to a substrate (114). Additional circuit components (140) are also bonded to the substrate. The substrate is formed to include a number of conductive traces (18, 20), and the radio frequency identification tag and circuit components are electrically coupled to the traces via selective application of a printable conductive medium (130, 132).
Claims34
A radio frequency identification tag comprising:
- a substrate, the substrate formed to include a conductive trace;
- a radio frequency identification tag circuit chip secured to the substrate, the radio frequency identification tag circuit chip including a conductive pad;
- and
- a layer of conductive medium printed on the substrate and coupling the conductive pad to the conductive trace.
A radio frequency identification tag comprising:
- a substrate;
- a radio frequency identification tag circuit chip secured to the substrate, the radio frequency identification tag circuit chip including a first conductive pad and a second conductive pad;
- an antenna secured to the substrate, the antenna having a first antenna lead and a second antenna lead;
- and
- a first layer of conductive medium printed on the substrate and coupling the first conductive pad to the first antenna lead and a second layer of conductive medium printed on the substrate and coupling the second conductive pad to the second antenna lead.
A radio frequency identification tag comprising:
- a substrate having plurality of conductive traces formed on a surface;
- a template secured to the surface, the template including a recess;
- a radio frequency identification tag circuit chip disposed within the recess and secured to the surface, the radio frequency identification tag circuit chip including a conductive pad;
- and
- a layer of conductive medium printed on the template and coupling the conductive pad to at least one of the plurality of conductive traces.
A circuit assembly comprising:
- a substrate, the substrate formed to include a conductive trace;
- a circuit chip secured to the substrate, the circuit chip including a conductive pad;
- and
- a layer of conductive medium printed on the substrate and coupling the conductive pad to the conductive trace.
A circuit assembly comprising:
- a substrate including a conductive trace formed on a surface;
- a template secured to the substrate, the template comprising a recess;
- a circuit chip disposed within the recess and secured to the substrate, the circuit chip including a conductive pad;
- and
- a layer of conductive medium printed on the template and coupling the conductive pad to the conductive trace.
A circuit assembly comprising:
- a substrate,
- a first circuit chip secured the substrate;
- a second circuit chip secured to the substrate;
- and
- a layer of conductive medium electrically coupling the first circuit chip and the second circuit chip, the layer printed on the substrate over the first circuit chip and under the second circuit chip.
Dependencies are inferred from the claim text.