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US 6,090,260 AGranted
Electroplating method
AssigneeTDK Corporation
InventorsSatoshi Inoue, Toyoaki Tanaka, Yoshiro Nakagawa
Life of this patent
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Abstract
A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
Claims5
A method of electroplating an object comprising the steps of:
- providing said object to be plated in a lower portion of a plating tank having a cathode in contact with the object and first and second anodes within the tank and spaced from the object;
- supplying a plating solution to said plating tank to immerse said object and said first and second anodes;
- supplying current from said first anode so that said object has cathodic potential;
- electroplating said object by supplying current from said second anode;
- and
- draining used plating solution from the plating tank,
- the current from said first anode being supplied when said object is immersed in the plating solution at least until the electroplating step.
4 more elements
Dependencies are inferred from the claim text.