Modular die sockets with flexible interconnects for packaging bare semiconductor die
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, David J. Corisis, Salman Akram
Life of this patent
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Abstract
A modular bare die socket assembly 10 for attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
Claims44
A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising:
- a plurality of plates, each plate of said plurality having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutted to the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end;
- a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with at least one of said plurality of conductive bond pads of said semiconductor die and outer ends for at least one lead of said leads to electrically contact a substrate;
- and
- resilient apparatus for forcing said inner ends into resilient contact with said at least one conductive bond pad of said plurality of conductive bond pads of said semiconductor die.
A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising:
- a plurality of plates, each plate of said plurality of plates having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutting the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end;
- a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with said plurality of conductive bond pads of said semiconductor die and outer ends for electrical contact with a substrate;
- and
- resilient apparatus for forcing said inner ends into resilient contact with said plurality of conductive bond pads of said semiconductor die.
A modular bare die interconnect socket for electrical connection to traces of a substrate, said socket comprising:
- a plurality of interconnect lead tapes having conductive leads formed thereon;
- a plurality of plates stacked side by side, each plate of said plurality of plates having a bare die insertion slot at one end and a lead tape insertion slot at an opposite end;
- one of said lead tapes placed through each said tape insertion slot between adjacent plates of said plurality of plates stacked side by side.
A plate adapted for abutting another adjacent plate to form an interconnect socket for a semiconductor die for connection to a substrate, said plate comprising:
- a generally planar member formed of an insulative material, said planar member having a first side and a second side, a first end and a second end;
- said second side including a recessed die slot for insertion of a bare die from said first end;
- said first side including a recess for holding an interconnect lead tape for resilient contact with said die and said substrate;
- and
- whereby said second side of said planar member abutted to a first side of said another adjacent plate forms a module for removable insertion of said semiconductor die for electrical interconnection to said substrate.
A multi-layer interconnect tape for interconnecting bond pads of a semiconductor die to a substrate, said tape comprising:
- a first layer of insulative film having first and second surfaces;
- a second layer of conductive material formed on said first surface of said first layer of insulative film;
- wherein said second layer of conductive material is formed as a plurality of conductive leads having first ends bent to form nodes for contact with a row of bond pads on said semiconductor die and having second ends for connection to conductive traces on said substrate.
Dependencies are inferred from the claim text.