Electrode connection method

A method for producing an optical modulation apparatus which includes:

• an optical modulation panel;
• a tape carrier package structure comprising a flexible substrate, a semiconductor device for driving the panel mounted on the flexible substrate, and input electrodes and output electrodes for the semiconductor device;
• and a circuit board provided with connection electrodes partially coated with resist pattern so as to leave an opening thereof and supplying power and supplying control signals to the semiconductor device;
• said processing comprising the steps of:
• (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure,
• (b) coating the connection electrodes with a solder at the opening of the resist pattern,
• (c) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and
• (d) electrically connecting the input electrodes to the connection electrodes through the solder by heat-pressing the input and connection electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head.

A method for producing an optical modulation apparatus which includes:

• an optical modulation panel;
• a tape carrier package structure comprising a flexible substrate a semiconductor device for driving the panel mounted on the flexible substrate, and input electrode and output electrodes for the semiconductor device;
• and a circuit board provided with connection electrodes for supplying power and supplying control signals to the semiconductor device;
• said process comprising the steps of:
• (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure,
• (b) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and
• (c) electrically connecting the input electrodes to the connection electrodes by a heat-pressure bonding using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head, while supplying a cooling gas toward the circuit board via the flexible substrate.