Thermoelectric conversion component
AssigneeSeiko Instruments R&D Center Inc.
InventorsMatsuo Kishi, Minao Yamamoto, Yoshifumi Yoshida
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AssigneeSeiko Instruments R&D Center Inc.
InventorsMatsuo Kishi, Minao Yamamoto, Yoshifumi Yoshida
Estimating the term…
A .pi.-type thermoelectric conversion component detects and controls temperature and at the same time exhibits a cooling performance inherently possessed by the thermoelectric conversion component without the need for mounting a discrete temperature detecting unit. To achieve this, a temperature detecting unit, such as a thin film thermistor or doped semiconductor region, is directly integrated on a surface of a substrate forming the thermoelectric component. In one embodiment, a monocrystalline silicon wafer is used as at least one of the opposing substrates of the thermoelectric conversion component, a temperature detecting unit having a diffused resistor is formed therein. An electrode of the temperature detecting unit is connected to an electrode formed on the opposing substrate to reduce the thermal load. There is thus no need for mounting a discrete temperature detecting unit, which places a thermal load on the thermoelectric conversion component, and it is thus possible to perform temperature detection from the same substrate to which a power supply of the thermoelectric conversion component is applied. It is also possible to obtain a cooling performance inherently possessed by the thermoelectric conversion component without the need to increase the performance criteria of the device to incorporate a temperature detecting unit.
A thermoelectric conversion component comprising:
A thermoelectric conversion component comprising:
A thermoelectric conversion component comprising:
A thermoelectric conversion component comprising:
Dependencies are inferred from the claim text.