Method and apparatus for optically modulating light through the back side of an integrated circuit die
AssigneeIntel Corporation
InventorsMario J. Paniccia, Valluri R. M. Rao, Ian A. Young
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AssigneeIntel Corporation
InventorsMario J. Paniccia, Valluri R. M. Rao, Ian A. Young
Estimating the term…
An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and non-phase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted.
An optical modulator, comprising:
A method of modulating a light beam, the method comprising the steps of:
A method of providing an optical modulator, the method comprising:
An optical modulator, comprising:
Dependencies are inferred from the claim text.