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US 6,074,097 AGranted
Package, package manufacturing method and package manufacturing system for carrying out the package manufacturing method
AssigneeDai Nippon Printing Co., Ltd.
InventorsKazuyoshi Hayashi, Koji Shimizu, Kozo Mita
Life of this patent
Estimating the term…
Abstract
A pair of superposed laminated films are fed by a web feed unit, and a longitudinal heat-sealing unit and a lateral heat-sealing unit unite together the pair of films by heat-sealing. A notch and tearing incision forming unit forms notches and tearing incisions in the pair of films. A cutting unit cuts the thus processed pair of united films into packages.
Claims6
A package comprising a pair of superposed films each having at least a laser beam absorbing layer, which pair is united together by heat-sealing the corresponding film peripheries thereof,
- wherein (1) tearing incisions extending between opposite side edges of the superposed films are formed on surfaces of the films by heating and melting the laser beam absorbing layers, (2) each of the tearing incisions extends continuously between the opposite side edges of the superposed film, and (3) a width of end parts of the tearing incision is from two to ten times greater than that of a middle part of the tearing incision.
Dependencies are inferred from the claim text.