semiconductor light emitting devices
AssigneeRicoh Company, Ltd.
InventorShunichi Sato
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AssigneeRicoh Company, Ltd.
InventorShunichi Sato
Estimating the term…
Nitrogen-containing III-V alloy semiconductor materials have both a conduction band offset .DELTA.Ec and a valence band offset .DELTA.Ev large enough for the practical applications to light emitting devices. The semiconductor materials are capable of providing laser diodes, having excellent temperature characteristics with emission wavelengths in the red spectral region and of 600 nm or smaller, and high brightness light emitting diodes with emission wavelengths in the visible spectral region. The light emitting device is fabricated on an n-GaAs substrate, which has the direction normal to the substrate surface is misoriented by 15.degree. from the direction normal to the (100) plane toward the [011] direction. On the substrate, there disposed by MOCVD, for example, are an n-GaAs buffer layer, an n-(Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer, an (Al.sub.0.2 Ga.sub.0.8).sub.0.49 In.sub.0.51 N.sub.0.01 P.sub.0.99 active layer, a p-(Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer, and a p-GaAs contact layer.
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A semiconductor light emitting device comprising:
A laser diode device comprising:
Dependencies are inferred from the claim text.