Bellows container packaging system and method
AssigneeTexas Instruments Incorporated
InventorsGeorge A. Bednarz, Jeremias P. Libres, Subramanian Krishnamurthy, Thongioem Phanatnok
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Abstract
An improved mold system (20) is provided. The mold system (20) includes a mold (30) having at least one mold cavity (28). A pot (22) is connected to each of the mold cavities (28) through a runner system (24). A bellows container (50) containing a molding material (60) is disposed with the pot (22). A plunger (31) applies a compressive load to the molding material (60) contained with the bellows container (50) to force the molding material (60) through the runner system (24) into the mold cavities (28).
Claims20
A molding system comprising:
- a mold having a mold cavity disposed within the mold;
- a pot connected to the mold cavity through a runner system;
- a bellows container disposed within the pot and having a molding material disposed therein;
- and
- a plunger slidably disposed within the pot operable to apply a load to the bellows container and dispense the molding material through the runner system into the mold cavity.
A bellows container for dispensing a molding material into a mold, the bellows container comprising:
- a closed receptacle having a first end and a second end connected by a side wall and containing the molding material;
- wherein the fi rst end includes a lid operable to open for dispensing molding materials into the mold;
- and
- wherein the side wall comprises at least one fold to allow the second end to move from a first position to a second position, the first position corresponding to a first receptacle volume and the second position corresponding to a second receptacle volume, the second receptacle volume being less than the first receptacle volume.
A method of encapsulating a semiconductor device, the method comprising the steps of:
- forming a mold having a mold cavity connected to a pot by a runner system;
- disposing a bellows container containing a molding material within the pot;
- disposing the semiconductor device within the mold cavity;
- transferring the molding material from the bellows container through the runner system into the mold cavity to encapsulate the semiconductor device;
- and
- solidifying the molding material within the mold cavity.
Dependencies are inferred from the claim text.